Semiconductor Wafer Polishing and Grinding Equipment Market, By Region (North America, Europe, Asia Pacific, Latin America, and Middle East & Africa) - Trends, Analysis and Forecast till 2034

Grinding and polishing are major components of the semiconductor wafer fabrication process. They are often dependent on end-user customization and packaging requirements. Grinding is generally performed for wafer thinning, while polishing ensures a smooth and damage-free surface. However, in most of the latest equipment, the grinding and polishing tasks are integrated into a single device, to overcome the drawbacks of performing these operations separately. Any kind of grinding method causes certain damage to the wafer. Semiconductor Wafer Polishing and Grinding Equipment Market worth US$ 368.31 Million in 2020.

Increase in Capital Spending

Increase in capital spending is one of the major factors driving the semiconductor wafer polishing and grinding equipment market. One of the main drivers of the semiconductor wafer polishing and grinding equipment market is the increased spending by various foundries and IDMs. The increase in the capital spending indicates that foundries are focusing on purchasing new equipment or identifying new production technologies and materials that can be used to produce ICs. The increase in capital spending will drive the growth of the semiconductor wafer polishing and grinding equipment market as capital spending will include the purchase of semiconductor equipment for the fabrication of ICs.

Increasing Demand from Third Party Vendors

In the current market scenario, semiconductor companies are increasingly leaning toward distinguishing their products in new ways. In order to achieve this, many wafer vendors are in direct contact with downstream players to avoid any intermediate players. This is the biggest factors that helps achieve this differentiation. Association of huge companies, like companies Google, Amazon, Tesla, Microsoft, and AMD, and several major foundries in the market indicates the shift in market trends. This trend is increasingly creating demand for polishing and grinding services rather than creating a direct demand for the equipment. Companies are increasingly preferring to outsource theses polishing and grinding operations, rather than procuring high priced semiconductor wafer polishing and grinding equipment and setting up highly complicated manufacturing establishments for their operations.

High Development Costs

One of the major challenges faced by the semiconductor wafer polishing and grinding equipment market is the high development costs associated with the manufacturing of semiconductor equipment. Semiconductor wafer polishing and grinding equipment requires polishers, grinders, and rotating platens, which are expensive to procure. Also, since there are only a few suppliers of those components, vendors need to invest heavily in acquiring these products. The increasing costs of polishing and grinding consumables, such as slurries and pads, add to the overall cost. Each equipment costs around a million dollars, making the initial investment for various foundries considerably high. Such equipment will also have a high repair and maintenance cost, which further adds to the overall cost.

One trend in the market is use of Nanoelectromechanical systems (NEMS). NEMS are devices that integrate electro and mechanical systems at a nanoscale. NEMS have a wide range of features such as significantly lower power consumption and production costs, due to their relatively small size. This makes them suitable for devices such as ultrasensitive sensors and high-frequency resonators. NEMS can also be used in a number of devices such as energy harvesters, accelerometers, gyroscopes, drug delivery systems, and portable power generators.

The semiconductor wafer polishing and grinding equipment market is segmented based on region.

Regional Insights:

On region the semiconductor wafer polishing and grinding equipment market is segmented into North America, Europe, Asia Pacific, Latin America, and Middle East & Africa. The market in North America dominates the global market in terms of revenue and is projected to continue its dominance in the coming years. The region is likely to remain one of the major revenue contributors to the market studied, over the forecast period, as fabless companies (indirect), integrated device manufacturers, and foundries are increasing several activities for semiconductor wafer manufacturers. The Asia-Pacific region offers a wide range of opportunities for growth in the market, compared to other parts of the world. The market in the region witnessed high demand from Outsourced Semiconductor Assembly and Test (OSAT), owing to the increasing consolidation in the fabless market.

Report Scope:

Attribute	Details
Base year for estimation	2023
Forecast period	2024 – 2034
Market representation	Revenue in USD Million & CAGR from 2024 – 2034
Regional scope	North America - U.S., Canada Europe - UK, Germany, Spain, France, Italy, Russia, Rest of Europe Asia Pacific - Japan, India, China, South Korea, Australia, Rest of Asia-Pacific Latin America - Brazil, Mexico, Argentina, Rest of Latin America Middle East & Africa - South Africa, Saudi Arabia, UAE, Rest of Middle East & Africa
Report coverage	Revenue forecast, company share, competitive landscape, growth factors, and trends

Segments Covered in the Report:

This report forecasts revenue growth at global, regional, and country levels and provides an analysis of the latest industry trends and opportunities in each of the sub-segments from 2024 to 2034. For the purpose of this study, has segmented the Semiconductor Wafer Polishing and Grinding Equipment Market report based on Region.

Semiconductor Wafer Polishing and Grinding Equipment Market, By Region:

• North America
  • U.S.
    • Canada
    • Europe
      • • Germany
        • UK
        • France
        • Russia
        • Italy
        • Rest of Europe
    • Asia Pacific
      • • China
        • India
        • Japan
        • South Korea
        • Rest of Asia Pacific
    • Latin America
      • • Brazil
        • Mexico
        • Rest of Latin America
    • Middle East & Africa
      • • GCC
        • Israel
        • South Africa
        • Rest of Middle East & Africa

The key players operating the semiconductor wafer polishing and grinding equipment market includes Applied Materials Inc., Ebara Corporation, Tokyo Seimitsu Co. Ltd, Disco Corporation, Lapmaster, Logitech, Entrepix, Revasum, Logomatic, and Axus Technology. Prominent players operating in the target market are focusing on the strategic partnerships as well as launching of the products in order to gain competitive edge in the target market.

For instance, in November 2018 - Applied Ventures LLC, the venture capital arm of Applied Materials Inc., announced a new co-investment initiative with Empire State Development (ESD), New York State’s economic development organization, aimed at accelerating innovation in upstate New York. The goal of this initiative is to invest in promising upstate New York startups across a broad range of established and emerging industries, including semiconductors, AI, advanced optics, autonomous vehicles, life sciences, and clean energy, among others. In December 2018, Tokyo Big Sight announced the launch of their DFG8640 which is a fully automatic grinder compatible with 8”-diameter wafers which is very good for lithium tantalite, silicon, silicon carbide and lithium niobate. DFG8640 will help to improve the productivity and can achieve high-precision grinding through (1) optimizing the processing point layout.

• Applied Materials Inc.
  • Company Overview
  • Product Portfolio
  • Key Highlights
  • Financial Performance
  • Business Strategies
• Ebara Corporation
• Tokyo Seimitsu Co. Ltd
• Disco Corporation
• Lapmaster
• Logitech
• Entrepix
• Revasum
• Logomatic
• Axus Technology

 “*” marked represents similar segmentation in other categories in the respective section

1. Research Objective and Assumption
   • Preface
   • Research Objectives
   • Study Scope
   • Years Considered for the study
   • Assumptions
   • Abbreviations
2. Research Methodology
   • Research data
   • Primary Data
     • Primary Interviews
     • Primary Breakdown
     • Key data from Primary Sources
     • Key Thickness Insights
   • Secondary Data
     • Major Secondary Sources
     • Secondary Sources
   • Market Estimation
   • Top-Down Approach
     • Approach for estimating Market Share by Top-Down Analysis (Supply Side)
   • Bottom-Up Approach
     • Approach for estimating market share by Bottom-up Analysis (Demand Side)
   • Market Breakdown and Data Triangulation
   • Research Assumptions
3. Market Preview
   • Executive Summary
   • Key Findings—Global Outlook for medical carts Strategies
     • Key Questions this Study will Answer
     • Market Snippet, By Region
   • Opportunity Map Analysis
   • Executive Summary—3 Big Predictions
4. Market Dynamics, Regulations, and Trends Analysis
   • Market Dynamics
     • Drivers
     • Restrains
     • Market Opportunities
     • Market Trends
   • DR Impact Analysis
   • PEST Analysis
   • Porter’s Five Forces Analysis
   • Opportunity Orbit
   • Market Investment Feasibility Index
   • Macroeconomic Factor Analysis
5. Global Market, By Region, Forecast Period up to 10 Years, (US$ Bn)
   • Overview
     • Market Value and Forecast (US$ Bn), and Share Analysis (%), Forecast Period up to 10 Years
     • Y-o-Y Growth Analysis (%), Forecast Period up to 10 Years
     • Regional Trends
   • North America
     • Market Size and Forecast (US$ Bn), By Country, Forecast Period up to 10 Years
       • U.S.
       • Canada
   • Europe
     • Market Size and Forecast (US$ Bn), By Country, Forecast Period up to 10 Years
       • UK
       • France
       • Germany
       • Russia
       • Italy
       • Rest of Europe
   • Asia Pacific
     • Market Size and Forecast (US$ Bn), By Country, Forecast Period up to 10 Years
       • India
       • Japan
       • South Korea
       • China
       • Rest of Asia Pacific
   • Latin America
     • Market Size and Forecast (US$ Bn), By Country, Forecast Period up to 10 Years
       • Brazil
       • Mexico
       • Rest of Latin America
   • Middle East & Africa
     • Market Size and Forecast (US$ Bn), By Country, Forecast Period up to 10 Years
       • GCC
       • Israel
       • South Africa
       • Rest of Middle East
6. Competitive Landscape
   • Heat Map Analysis
   • Market Presence and Specificity Analysis
7. Company Profiles

• Ebara Corporation
  • Company Overview
  • Product Portfolio
  • Key Highlights
  • Financial Overview
  • Business Strategies
• Tokyo Seimitsu Co. Ltd
  • Company Overview
  • Product Portfolio
  • Key Highlights
  • Financial Overview
  • Business Strategies
• Disco Corporation
  • Company Overview
  • Product Portfolio
  • Key Highlights
  • Financial Overview
  • Business Strategies
• Lapmaster
  • Company Overview
  • Product Portfolio
  • Key Highlights
  • Financial Overview
  • Business Strategies
• Logitech
  • Company Overview
  • Product Portfolio
  • Key Highlights
  • Financial Overview
  • Business Strategies
• Entrepix
  • Company Overview
  • Product Portfolio
  • Key Highlights
  • Financial Overview
  • Business Strategies
• Revasum
  • Company Overview
  • Product Portfolio
  • Key Highlights
  • Financial Overview
  • Business Strategies
• Logomatic
  • Company Overview
  • Product Portfolio
  • Key Highlights
  • Financial Overview
  • Business Strategies
• Axus Technology
  • Company Overview
  • Product Portfolio
  • Key Highlights
  • Financial Overview
  • Business Strategies

1. The Last Word
   • Future Impact
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   • Contact