Chemical Mechanical Planarization Market Size, Share, By Type [(CMP Equipment, and CMP Consumables (Slurry, Pad, and Pad Conditioner)], By Application (Integrated Circuits, Microelectromechanical Systems & Nanoelectromechanical Systems, Compound Semiconductors, and Optics), and By Region - Trends, Analysis and Forecast till 2034

• In 2023, chemical mechanical planarization market was estimated to be worth USD 6.01 billion.
• By 2034, the target market is expected to grow to USD 14.4 billion.
• Target market is expanding at a CAGR of 9.40%

Market Overview:

Increasing demand from semiconductor industry for chemical and mechanical polishing is the major factor driving growth of the chemical mechanical planarization market. Increasing adoption of products such as smartphones, tablets, and other electronic devices is another factor expected to fuel growth of the global market over the forecast period. In addition, rising demand for Microelectromechanical systems is also expected to further fuel growth of the global market over the forecast period. However, major factor restraining growth of the chemical mechanical planarization market is stringent government regulations and lack of standards on use of slurries and abrasives. Furthermore, cyclical and fluctuating nature of semiconductor industry is projected to hamper growth of the global market. The global market is emphasizing on improving production efficiency and technology node progression over the forecast period.

Key Takeaways:

• Asia Pacific held the largest share of the market in 2024.
• North America is projected to be the fastest-growing market in the coming years.
• By type, the CMP Consumables segment accounted for the largest share of the market in 2024.
• By application, the integrated circuit segment dominated the market.

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Key Drivers of Target Market:

Increasing Adoption in Semiconductor Industry

• CMP is used multiple times in the manufacturing process of semiconductor at each wafer layer to remove excess materials and to create a smooth surface. It is used for the purpose of planarization of oxide dielectric and metal layer. Increasing demands for PCs, mobile devices, increases the chip production which ultimately increases the demand of CMP in semiconductor industry.
• For Instance, in August 2024, according to article published by AspenCore Inc., an electronic media group, the chemical-mechanical planarization, advancements like reduced stress, which impact wafer shape, particularly bow and warp are crucial, as they can pose significant wafer handling and processing challenges in semiconductor industry.

Restrains:

Corrosive Attacks

• The term corrosion in the CMP indicates negative implication. Corrosive attacks from chemicals are an end result defect such as pitting, staining, surface roughness, etc. The corrosion process starts with the oxidation of the copper surface to Cu+1 and Cu+2. 
• Counterbalance Statements: One of the major solutions to this problem are utilization of corrosion inhibitors, chelating agents, alkaline cleaning solutions, inhibitors mixture, etc.

Opportunities:

Economies of Growth in Infancy

• Emerging markets in Asia Pacific, North America, and Latin American regions, which consider increasing demand for consumer electronics and automobiles, advance developments, and rapid growth in semiconductor sector as growing factors, create major opportunities for the market's growth, especially in manufacturing of semiconductor

The market is segmented based on Type, Application and Region  

Type Insights:

On the basis of Type Chemical Mechanical Planarization Market is segmented into CMP Equipment, CMP Consumables (Slurry, Pad, and Pad Conditioner). The slurry segment of CMP consumables dominate the target market growth as it contains active chemicals and micro-abrasive grains used for CMP.

Application Insights:

The chemical mechanical planarization market by ingredients is segmented into Integrated Circuits, Microelectromechanical Systems & Nanoelectromechanical Systems, Compound Semiconductors, and Optics. Integrated circuit (IC) is expected to witnessing highest growth of the market during forecast period.

Regional Insights

• Asia Pacific: This region is expected to dominate the growth of the market during forecast period due to expansion in the consumer electronics sector and rise in investment in semiconductor manufacturing in the region.
• North America: This region is considered to be the fastest growing region in the target market as countries like U.S., and many more are leading the charge significantly due to rising adoption of CMP in semiconductor industry, increasing usage of advance technologies, etc.

Chemical Mechanical Planarization Market Report Scope:

Segments Covered in the Report:

This report forecasts revenue growth at global, regional, and country levels, analyzing industry trends and opportunities across sub-segments from 2024 to 2034. It segments the market by Type, Application, and Region.

Segmentation:

By Type:

• CMP Equipment
• CMP Consumables

• Slurry
• Pad
• Pad Conditioner

By Application:

• Integrated Circuits
• Microelectromechanical Systems & Nanoelectromechanical Systems
• Compound Semiconductors
• Optics

By Region:

• North America
  • U.S.
  • Canada
• Europe
  • Germany
  • UK
  • France
  • Russia
  • Italy
  • Rest of Europe
• Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia Pacific
• Latin America
  • Brazil
  • Mexico
  • Rest of Latin America
• Middle East & Africa
  • GCC
  • Israel
  • South Africa
  • Rest of Middle East & Africa

The key players operating in the Chemical Mechanical Planarization Market include Applied Materials Inc., Ebara Corporation, Cabot Microelectronic Corporation, Dow Electronic Materials Inc., Fujimi Inc., Honeywell Electronic Materials Inc., Strasbaugh Inc., Air Products & Chemicals Inc., Lapmaster Wolters GmbH, Hitachi Chemical Co. Ltd., Samsung Electronics Co. Ltd., Micron Technology, BASF SE, and LAM Research Corporation.

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• In July 2024, Axus Technology provider of CMP equipment, announced a highest sales momentum for its innovative Capstone R- CS200 Series which is the industry’s latest CMP processing tool, as the company received orders from silicon carbide (SiC) semiconductor makers based in Europe, Asia and North America.
• In September 2024, Adeia Inc., a leading company of invention of semiconductor technology, announced presentation of its semiconductor technologies which focus on Adeia’s hybrid bonding technology, next-generation high-performance computing and AI applications.

 Analyst View:

The industry for chemical mechanical planarization is placed for substantial growth due to increasing usage in semiconductor industry. Increasing adoption of products such as smartphones, tablets, and other electronic devices, advance technologies as well as many collaborations and partnerships helps to boost the growth of the market in upcoming years.

• Applied Materials Inc.
• Ebara Corporation
• Cabot Microelectronic Corporation
• Dow Electronic Materials Inc.
• Fujimi Inc.
• Honeywell Electronic Materials Inc.
• Strasbaugh Inc.
• Air Products & Chemicals Inc.
• Lapmaster Wolters GmbH
• Hitachi Chemical Co. Ltd.
• Samsung Electronics Co. Ltd.
• Micron Technology
• BASF SE
• LAM Research Corporation.

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